Chemical Cleaning and Polishing: The Precision Art of Semiconductor Surface Treatment
Chemical cleaning and polishing, as the precision art of semiconductor surface treatment, jointly ensure the high quality and reliability of semiconductor devices. Chemical cleaning achieves the purposes of oil removal, rust removal, scale removal, and decontamination by chemically transforming, dissolving, and stripping contaminants or coatings on the object's surface through chemical agents.
In semiconductor manufacturing, the chemical cleaning process encompasses multiple steps, including soap cleaning, alkaline cleaning, acid cleaning, neutralization, and passivation. Soap cleaning, serving as the pre-treatment stage, may involve operations such as oil removal and rust removal to eliminate impurities and dirt from the equipment surface, providing a good foundation for subsequent cleaning steps. Alkaline cleaning employs alkaline chemicals (such as sodium hydroxide and sodium carbonate) for cleaning, primarily used to remove grease and mild rust. It has excellent efficacy in eliminating organic contaminants like cutting fluids and fingerprints adhered to the wafer surface. Acid cleaning utilizes acidic chemicals (such as hydrochloric acid and sulfuric acid) for cleaning, mainly used to dissolve more stubborn rust and scale. In semiconductor manufacturing, it can effectively remove the oxide layer on the surface of metal lead frames.
The neutralization step is crucial after acid cleaning. Neutralizing agents (such as sodium nitrite and sodium benzoate) are used to treat the residual acidic environment, preventing equipment rusting and avoiding adverse effects of acidic substances on subsequent processes and device performance. Passivation treatment acts as the final line of defense to prevent the equipment from being oxidized or corroded again. It forms a passivation film on the metal surface, enhancing the metal's corrosion resistance.
Chemical polishing achieves surface leveling of parts by utilizing the principle that the convex parts on the metal surface dissolve faster than the concave parts. Through processes such as degreasing, water rinsing, acid cleaning, chemical polishing, neutralization, water rinsing, passivation, and packaging, high-quality polishing results can be obtained. Chemical polishing does not require an external power source or complex equipment, featuring simple operation and low cost. It is particularly suitable for treating parts with thin tubes, deep holes, and complex shapes. In semiconductor manufacturing, for some small parts or components with special structures, chemical polishing can effectively improve surface quality and enhance device performance.
With the increasing environmental protection requirements, green chemical cleaning agents have become a research hotspot. These cleaning agents use biodegradable components, reducing harm to the environment while maintaining excellent cleaning performance. For example, cleaning agents based on citric acid exhibit outstanding performance in removing metal oxides and are harmless to humans. They are gradually being applied in the chemical cleaning of semiconductor manufacturing.
AMTD provides high-precision Showerhead (spray head/gas distribution plate/gas diffuser) services for core components. Its products mainly include semiconductor equipment core parts such as Showerhead, Face plate, Blocker Plate, Top Plate, Shield, Liner, pumping ring, and Edge Ring. These products are widely applied in fields such as semiconductors and display panels, boasting excellent performance and high market recognition.
Content sources: Advances in Semiconductor Surface Treatment Technologies, Introduction to Surface Treatment Processes
